Suppliers
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LoRa and LoRaWAN Chipsets
Antenna Solutions for IoT Devices
LED Driver and Power Solutions
Flash Memory and DRAM Solutions
Microcontrollers and Embedded ICs
Enterprise SSD Storage Solutions
Edge Interface & Sensing
Automotive and Industrial Sensor ICs
MEMS Speakers and Thermal Management
MEMS Microphones and DSP Software
Networked Audio Processing Solutions
GaN & Class-D Amplifier Modules
Custom ASIC Design Services
Semiconductor CAD Partner and Design Tools
Advanced ASIC Design and Manufacturing Partner
Image Sensors and Imaging Solutions
WIRELESS IoT & COMM'S
Semtech
Semtech is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms. Semtech focus areas are:
Cellular IoT Solutions
Leading edge-to-Cloud solutions delivering the device, software and connectivity services needed to simplify and accelerate data-driven transformation with cellular IoT.LoRa Wireless RF
LoRa®, a long range, low power platform, and the de facto wireless platform of Internet of Things, is highly integrated and cost-effective, boasting a notable battery life of up to 20 years, a 3-mile range in urban environments and a 30-mile range outdoors.
Circuit Protection
Sophisticated devices that protect sensitive circuitry from Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Cable Discharge Events (CDE), and other electrical overstress.
Signal Integrity
A comprehensive portfolio of innovative optical, analog and mixed-signal semiconductor solutions that serve the rising global demand for high-speed data transmission products.Professional AV
Advanced off-the-shelf technology that enables end-to-end systems and integrates advanced inline signal processing capabilities such as light compression, broadcast quality scaling and audio down-mixing.PerSe® Smart Sensing
Ultra-low power, feature-rich touch controllers that are optimized for numerous applications and provide best-in-class sensitivity with robust noise immunity to enhance touch and near range proximity detection.
Broadcast Video
Award-winning solutions designed specifically to push real-world broadcast boundaries in performance, reach, power, and signal integrity while reducing time to market and design risks. Also provides solutions to switch and resize single multiple audio/video inputs from/to single/multiple outputs over ethernet without the need for a dedicated control box.Power Management
A pioneer in power management ICs across networking and industrial power, handheld power and automotive applications, Semtech leads the quest to enable a new class of greener, smarter and smaller end products.
Link to Semtech
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For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan BennettCentral Europe: Matthias Spahn & Willi Bolz
Ignion
Ignion, headquartered in Barcelona, designs, manufactures, and commercializes miniature, off-the-shelf antennas for IoT, mobile connectivity, and short-range wireless devices. Founded in 2015 as an independent antenna product business, Ignion emerged from the main Fractus operation, combining a respected R&D team with proven manufacturing capabilities to bring a new generation of antenna products to market.
Their Virtual Antenna® technology offers adaptable, multiband antenna components that can be embedded in devices, allowing communication through various network connectivities, including 5G, Wi-Fi, and low-power wide-area networks. This approach simplifies antenna integration, enabling the same component to be used across different form factors and frequency bands.
Ignion’s product lineup includes the mXTEND™ series, such as NANO, ONE, DUO, TRIO, ALL, RUN, and OMNIA, covering operating ranges from 400 MHz to 10.6 GHz. These antennas cater to applications in smart metering, asset tracking, automotive telematics, and more.
To assist manufacturers in integrating their antenna technology, Ignion provides resources like engineering support, application notes, FAQs, webinars, whitepapers, design guides, and case studies. Their AI-powered platform, Oxion™, further streamlines the antenna design process.
Link to Ignion
Link for 24h Fast Track Antenna design service: Click here
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Inventronics
Inventronics is a global supplier of LED lighting technology. Following the acquisition of OSRAM Digital Systems, the company has strengthened its international footprint and now operates R&D, manufacturing, and support facilities across Europe, Asia, and the Americas. The "Inventronics" name was kept, and the OSRAM-orange color was adapted for the logo.
With a strong focus on LED drivers, lighting controls, sensors, and LED modules, Inventronics offers a comprehensive portfolio for professional lighting applications. Their solutions are used in offices, industrial facilities, retail environments, hospitality projects, architectural lighting, sports venues, street lighting, and other public spaces.
Inventronics products are designed to meet demanding international standards while delivering high energy efficiency, reliable performance, and flexibility across a wide range of lighting designs.
For more information, please contact:
Winbond
Winbond is a 1B$+ Specialty Memory IC manufacturer from Taiwan with a 30+ years history. Their portfolio includes both FLASH and DRAM and can support the entire need for memory solutions in most applications.
The products fit very well to the Nordic industry for 3 key reason:- Winbond offers lifetime support
- The Memory sizes are well suited for the industrial, IoT, Communication and Consumer applications in our territory
- Winbond have their own 12” fabs, and hence have full control of the complete production flow
The full control of manufacturing secures highest level of quality and includes support for KGD deliveries including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test etc.
Link to Winbond
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Nuvoton
Nuvoton is a sister company of Winbond, a leading memory supplier and long-standing partner of Indesmatech. Both companies are part of the Taiwan-based Walsin Group, a well-established technology and electronics group with a strong global presence.
Nuvoton is an establish supplier of these technologies with full end-to-end support on all products. They are the fastest growing MCU supplier WW and ranked no. 7 globally, which may be a surprise to EU based customers, as this position is obtained primarily from activities in Asia and America.
The initial focus from the complete portfolio includes:
- 8 bit 8051 MCUs - link
- ARM Cortex-M0 – link
- ARM Cortex M23 – link
- ARM Contex M4 – link
- ARM Cortex M7 - link
- ARM Contex A35 MPUs - link
- ARM9 MPUs - link
- Nuvoton Sound Processors NSP - link
All products are supported with tools available free of charge from the website and technical expertise offered by the Indesmatech team. We can also supply NSP sound processing EVKs for technical evaluation.
Nuvoton’s wider portfolio includes products for applications in Power, Sensors and IoT solutions. We are ready to support all products from their portfolio.
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Solid State Storage Technology Corporation (SSSTC)
SSSTC, a subsidiary of KIOXIA Corporation, stands as a global leader in designing, developing, and manufacturing digital storage solutions. Building on its extensive success in Optical Disk Drives, the company established its Solid-State Drive (SSD) Division in 2008 to meet the growing demands for data storage.
SSSTC leads the industry, offering innovative designs, high-quality, and efficient products across a range of interface specifications and external dimensions. Their comprehensive lineup of SSDs caters to Enterprise, Industrial, Business Client, and Consumer markets. These SSDs come in various form factors and interfaces, ensuring the right fit for each application.
The company’s SSDs are entirely developed in-house by dedicated R&D teams, allowing for highly customizable solutions, including firmware design. Through partnerships with industry-leading component suppliers, SSSTC delivers SSD solutions known for their quality, reliability, and commitment to innovation and manufacturing excellence.
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Central Europe: Matthias Spahn
Synaptics
Synaptics is a leading provider of semiconductor and software solutions for the intelligent edge. Building on 40 years of innovation in human-interface technology, Synaptics today brings together two complementary technology areas: Edge Compute & Connectivity, including AI-native compute, wireless connectivity and audio processing and Edge Interface & Sensing, including touch, display and biometric technologies.
Its solutions address a broad range of applications across smart home and consumer IoT, enterprise systems, industrial and infrastructure, and physical AI and robotics.
Astra™ Edge AI and IoT processors
Synaptics Astra™ is a scalable AI-native compute platform designed specifically for IoT products. The portfolio combines high-performance processing, integrated AI acceleration, software, security and connectivity to enable intelligent processing directly at the edge.The Astra portfolio includes SL Series AI MPUs for Linux and Android applications and SR Series AI MCUs for power-efficient, context-aware AI. Applications range from vision and audio processing to smart home, industrial automation, smart security, wearables and other intelligent connected devices.
The scalable portfolio includes the SL1600 and SL2600 families together with SR-Series devices addressing Vision AI, Audio AI and other intelligent sensing applications. Synaptics complements the silicon with standards-based software, AI tooling and with Indesmatech an ecosystem of development and solution partners.
Wireless connectivity
Synaptics offers scalable wireless connectivity solutions for modern IoT and embedded systems, combining high performance, low power consumption, interoperability and security.The connectivity portfolio spans Wi-Fi, Bluetooth® Classic and Bluetooth Low Energy, and GNSS, with a roadmap covering Wi-Fi 6, Wi-Fi 7 and future Wi-Fi 8 generations. These technologies address applications including smart home, enterprise, PC and display products, mobile infrastructure, automotive, wearables and industrial systems.
Together with Astra processors, Synaptics wireless technologies provide a highly integrated platform for intelligent and securely connected edge devices.
Touch, display and sensing
Synaptics has a long history of innovation in human-machine interfaces, including the introduction of the notebook touchpad and early capacitive touchscreen technologies. Today its Edge Interface & Sensing portfolio includes capacitive touch controllers, touch and display interfaces, display-driver ICs and biometric sensors.These technologies enable intuitive and reliable interaction across consumer, enterprise and industrial products and can be combined with Synaptics processing and connectivity technologies to create complete intelligent-interface solutions.
Digital headset and Audio AI solutions
Synaptics provides advanced audio processing solutions for headsets, headphones, hearables, conferencing systems and other intelligent audio products.
The portfolio combines audio codecs, DSP processing and AI acceleration for applications such as voice processing, noise reduction, speech enhancement and intelligent sound processing. Synaptics' Astra SR Series extends this capability into Audio AI MCUs, bringing low-power, context-aware AI processing directly into audio devices.
Synaptics AudioSmart® technologies enable high-quality voice capture and processing for voice-enabled consumer, smart-home and enterprise products.
Advanced audio and voice-processing technologies help devices operate reliably in challenging acoustic environments and enable intelligent, always-on voice interfaces. Combined with Synaptics' Edge AI processing and connectivity technologies, these solutions support a new generation of locally intelligent and context-aware devices.
Link to Synaptics
For more information, please contact:
Jens J. Tybo Jensen
Melexis
Melexis is a Belgian semiconductor company that creates innovative microelectronic solutions for a better, more connected world. With over 35 years of experience, Melexis has grown from a small startup into a global enterprise, employing nearly 2.000 people across 18 countries and representing over 50 nationalities.
Focusing on the automotive industry and expanding into alternative mobility, smart appliances, smart buildings, robotics, energy management, and digital health, Melexis delivers high qullity sensor and driver ICs. Their portfolio includes magnetic position sensors, optical sensors, pressure and temperature sensors, and embedded motor drivers. Melexis offers 18 chips specifically designed for cars, serving both powertrain and chassis-body-safety applications.
The company’s strategy centers on innovation, leadership in sensing and driving solutions, and growth in non-automotive markets. This approach is guided by a set of core values: caring for people and the planet, strategic planning, understanding the value of resources, and embracing the journey toward success.
With a strong emphasis on R&D and a commitment to “inspired engineering,” Melexis continues to develop technologies that enhance safety, efficiency, and sustainability across industries, striving to shape the best imaginable future.
Link to Melexis
For more information, please contact:
Andreas Sternberg
xMEMS
xMEMS Labs is a semiconductor company based in Santa Clara, California, specializing in solid-state MEMS speakers, active acoustic vents, and µCooling (Micro Cooling) solutions. Built on its piezo MEMS silicon platform, these products combine compact size, consistent performance, and semiconductor manufacturing precision for personal audio and thermal management applications.
xMEMS offers a range of MEMS microspeakers, including Cowell, Montara Plus, Muir, and Lassen, for use in earbuds, IEMs, headphones, and hearing devices. Lassen operates without a dedicated piezo amplifier, reducing component count and space requirements. The PulseAir range uses ultrasonic modulation to generate sound, with XMA-9210, formerly Cypress, designed for full-range audio in earbuds.
For open-ear applications, the approximately 1 mm-thin PulseAir XMA-9320 (Cedar) supports compact designs for smart glasses, smartwatches, and XR headsets. xMEMS also provides Skyline active acoustic vents and reference designs to help manufacturers integrate its technology into personal audio products.
Beyond audio, xMEMS’ µCooling technology delivers targeted airflow using ultrasonic silicon membranes without rotating blades. The XMC family provides active cooling for space-constrained products, including wearables, smartphones, SSDs, and data center components. These thin, silent cooling chips help remove heat directly at critical components, reducing thermal throttling and supporting sustained device performance.
For more information, please contact:
Soundskrit
Soundskrit's product lineup features both analog and digital directional MEMS microphones which can replace conventional multi-microphone beamforming arrays with a single chip, enabling product designers to improve performance, decrease power consumption, and facilitate easier integration into smaller product form factors.
When used in combination with traditional omni-directional microphones, the Soundskrit two-port directional microphones can reduce the computational effort requirements for dynamic beamforming/audio zoom while maintaining high SNR to effectively distinguish speech from background noise. This capability ensures that the speaker's voice remains clear, even in crowded and noisy settings.
Further enhanced by Soundskrit’s SimplyDSP and SimplyAI software, features such as adjustable beamforming, voice activity detection, off-axis muting, automatic gain control, dynamic noise suppression, de-reverberation, and Direction-of-arrival (DOA) estimation further distinguishes the solutions.
These innovations makes the Soundskrit MEMS microphones ideal for a varaiety of applications including Headsets, TWS Earbuds, Webcams, Security Cameras, Smartspeakers, AR/VR Headsets, Laptops, Tablets, TVs and Conferencing Systems.
For more information, please contact:
Elytone
Elytone provides advanced audio solutions for audio brands to rapidly develop products for consumer, commercial, and professional applications. Their portfolio includes networked audio processing, HDMI audio, networked amplification, and power over Ethernet. Elytone solutions enable audio teams to jump start product development and focus time and resources on their unique product capabilities.
Their solutions support AoIP standards including Dante®, AES67, AES70/OCA, and PoE, enabling scalable and high-performance AoIP systems with high fidelity, low latency, advanced networked controls, and flexible integration. Elytone combines hardware, firmware, embedded software applications, acoustics, and manufacturing expertise to support customers from early development to volume production.
With decades of experience, Elytone delivers reliable and efficient system design tailored to customer requirements. Their partnering development approach can range from standard platforms to fully customized solutions, including DSP tuning, system optimization, custom software and features, AV pre-certification, production support, and in-field product support and updating.
For more information, please contact:
PEAK Amplification
Peak Amplification, a division of Elytone, specializes in high-performance Class-D amplifier platforms for professional, commercial, and residential audio. Leveraging Elytone’s decades of experience in high-performance amplifier designs, Peak Amplification offers turnkey solutions to reduce development time and accelerate product integration.
Partnering with Infineon Technologies, their portfolio includes Class-D amplifier modules based on MOSFET amplifiers for targeted applications. New GaN amplifiers based on Infineon CoolGaN™ technology deliver reference-quality audio performance with lower THD and noise, high efficiency, and reduced thermal output.
Peak Amplification supports customers with amplifier integration, power supply design, and system integration to ensure optimal audio performance. Their solutions are developed for reliability across demanding audio applications, including pro audio, commercial, consumer installed audio, and high-fidelity consumer products.
For more information, please contact:
ASIC
EnSilica
EnSilica stands at the forefront of fabless chip manufacturing, specializing in tailor-made ASICs for OEMs and system houses. Additionally, the company offers IC design services, catering to enterprises equipped with their own design teams. Renowned for its world-class proficiency, EnSilica excels in delivering custom RF, mmWave, mixed-signal, and digital ASICs to a diverse clientele spanning the automotive, industrial, healthcare, and communications sectors on a global scale.
EnSilica's comprehensive suite of core IP encompasses cryptography, radar, and communication systems. The company boasts a proven track record of providing high-quality solutions that align with extraordinary industry standards.
Listed below are some core services provided by EnSilica:
- Feasibility and choice of technology
- Specification phase
- ASIC design system and details
- ASIC layout
- Tape out and foundry interface
- Prototype delivery
- Validation of silicon
- Qualification and ramp to production
- Volume delivery and inventory management
- Field return analysis
For more than 20 years, EnSilica has gained solid experience servicing a wide group of companies ranging from start-ups to well established system houses. Over the years, a high number of projects has proven succesful within key areas of custom solutions. EnSilica’s project catalogue spans from module design with embedded software to the development of hadware platforms, including high complex multi-million gate system-on-chip architectures. EnSilica equals high quality and exquisite eye for bringing state of the art ideas to life.
Headquartered near Oxford, UK, EnSilica extends its design centres across the UK, India, and Brazil.
For more information, please contact:
Synergie CAD PSC
Synergie CAD PSC is a European semiconductor industrialisation and production services company based in Toulouse, France. They provide turn key back end solutions covering IC packaging, assembly management, test development, reliability qualification, and production testing. Their services support customers in industrial, automotive, consumer, space, and defence markets.
Founded in 2000, they built their background in PCB and electronic design for demanding sectors such as space and automotive. Over time, they expanded into a specialised semiconductor back-end service provider. Their processes align with industry standards such as JEDEC, AEC-Q100, and MIL-STD.
They also design and manufacture test hardware such as load boards and validation boards. Their flexible production model combines European manufacturing for low to mid volumes with a qualified global partner network for high volume production. Their goal is to help semiconductor companies move efficiently from prototype to volume production with controlled quality and lead times.
For more information, please contact:
Global Unichip Corporation (GUC)
In the world of advanced ASIC services, GUC sits on top as a market leader, publicly traded on the Taiwan Stock Exchange (TWSE). GUC also takes advantage of its strategic alliance with Taiwan Semiconductor Manufacturing Co. (TSMC), who has a 35% stake in the company. This collaboration helps GUC overcome challenges with technology access for ASIC development and manufacturing. The close ties with TSMC give GUC access to semiconductor processes, from 2nm CMOS and up.
GUC's design services span every phase of the process, including "Spec-in" and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies (APT) such as CoWoS, turnkey manufacturing, and the incorporation of leading technologies like HBM (High-Bandwidth Memory) and Die-to-Die Interconnect IPs. GUC’s APT system ensures integrated, discrete chips in one package, with ultra-computation power and optimized efficiency.
With a technology range extending from 2nm and up and a track record of over 250 tape-outs, GUC is well-positioned in the market. TSMC supplements this position by offering automotive qualified processes, broadening the useability of GUC's offerings to demanding tasks like autonomous driving. Additionally, GUC supports larger structure widths for ASIC implementation, providing diverse requirements in industrial, telecommunications, networks, and consumer applications.
GUC is for people seeking:
- Advanced ASIC technology for IP
- Addressing processor-intensive tasks in hardware
- Implementing custom System-in-Package solutions
For more information, please contact:
