Suppliers
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Semtech
Semtech is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms. Semtech focus areas are:
Cellular IoT Solutions
Leading edge-to-Cloud solutions delivering the device, software and connectivity services needed to simplify and accelerate data-driven transformation with cellular IoT.LoRa Wireless RF
LoRa®, a long range, low power platform, and the de facto wireless platform of Internet of Things, is highly integrated and cost-effective, boasting a notable battery life of up to 20 years, a 3-mile range in urban environments and a 30-mile range outdoors.
Circuit Protection
Sophisticated devices that protect sensitive circuitry from Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Cable Discharge Events (CDE), and other electrical overstress.
Signal Integrity
A comprehensive portfolio of innovative optical, analog and mixed-signal semiconductor solutions that serve the rising global demand for high-speed data transmission products.Professional AV
Advanced off-the-shelf technology that enables end-to-end systems and integrates advanced inline signal processing capabilities such as light compression, broadcast quality scaling and audio down-mixing.PerSe® Smart Sensing
Ultra-low power, feature-rich touch controllers that are optimized for numerous applications and provide best-in-class sensitivity with robust noise immunity to enhance touch and near range proximity detection.
Broadcast Video
Award-winning solutions designed specifically to push real-world broadcast boundaries in performance, reach, power, and signal integrity while reducing time to market and design risks. Also provides solutions to switch and resize single multiple audio/video inputs from/to single/multiple outputs over ethernet without the need for a dedicated control box.Power Management
A pioneer in power management ICs across networking and industrial power, handheld power and automotive applications, Semtech leads the quest to enable a new class of greener, smarter and smaller end products.
Link to Semtech
For more information specially on LoRa
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For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Ignion
Barcelona-based Ignion SL designs, manufactures and commercializes miniature, off-the-shelf antennas for IoT, mobile connectivity and short-range wireless devices. Founded as an independent antenna product business in 2015, Ignion was born out of the main Fractus operation and combines a respected R&D team with proven manufacturing capabilities and scale to bring to market a new generation of antenna products to meet the mobile and wireless connectivity needs of OEMs.
Link to Ignion
Link for 24h Fast Track Antenna design service: Click here
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
GreenWaves Technologies
GreenWaves is a fabless semiconductor company founded in 2014 and based in Grenoble, France. They design and market ultra low power processors for energy constrained products such as hearables, wearables, IoT & medical monitoring products.
GreenWaves’ system-on-chips enable companies to develop and bring to market products with new to world features enabled by state-of-the-art machine learning and digital signal processing techniques. Their leading-edge development tools enable audio and machine learning developers to productively harness the power of GAP processors.
GreenWaves GAP9 processor powers features such as neural network-based noise removal and adaptive noise cancellation, multi-channel spatial sound and listening enhancement technologies in next-generation earbuds and headphones with market-leading energy efficiency.
Key Applications include:
- Hearables & Wearables: GAP9 transforms audio devices with ultra-low-latency ANC, clear voice capture (ENC), and 3D spatial audio. Its energy efficiency extends battery life while delivering superior sound and innovative features.
- IoT Devices: GAP9 brings powerful, energy-efficient AI to battery-operated sensors. Devices can run for years on a single charge, enabling advanced edge capabilities like people counting, gesture recognition, and vibration analysis with minimal power use.
- Smart Security Systems: GAP9 enhances security devices with real-time image and sound processing at the edge. It supports AI-driven person/object detection, face identification, and sound analysis while extending battery life. Ideal for both wired and wireless applications, GAP9 ensures robust protection with low power consumption.
By partnering with hardware and software providers, GreenWaves enables Indesmatech to offer evaluation platforms with tailored, comprehensive solutions for diverse GAP-based applications.
Engineered and manufactured in the EU, GreenWaves' products deliver energy-efficient, real-time, ultra-low-latency audio and image processing.
Link to GreenWaves Technologies
For more information, please contact:
Winbond
Winbond is a 1B$+ Specialty Memory IC manufacturer from Taiwan with a 30-year history. The portfolio includes both FLASH and DRAM and can offer the entire need for memory solutions in many applications.
The products fit very well to the Nordic industry for 3 key reason:
> Winbond offers Long Lifetime Support
> The Memory sizes are well suited for the industryal, IoT, Communication and Consumer applications in our territory.
> Winbond have their own 12” fabs, and hence have full control of the complete production flow.
The full control of manufacturing secures highest level of quality and includes support for KGD deliveries including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test etc.
Link to Winbond
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Nuvoton
Nuvoton is a sister company to the memory supplier Winbond who we have worked with for many years. Both Winbond and Nuvoton belong to the Taiwan based Walsin Group.
Nuvoton is a very well establish supplier of these technologies with full end-to-end support on all products. They are the fastest growing MCU supplier WW and ranked no 7 globally which may be a surprise to EU based customers, as this position is obtained primarily from activities in Asia and America.
The initial focus from the complete portfolio includes:
8 bit 8051 MCUs - link
ARM Cortex-M0 – link
ARM Cortex M23 – link
ARM Contex M4 – link
ARM Cortex M7 - link
ARM Contex A35 MPUs - link
ARM9 MPUs - link
Nuvoton Sound Processors NSP - link
All products are supported with tools available free of charge from the website and the technical expertise offered by the Indesmatech team.
We have NSP sound processing EVKs available if you want to test the technology.
Nuvoton’s wider portfolio includes products for applications in Power, Sensors and IoT solutions. We are obviously ready to support all products from the portfolio.
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
Solid State Storage Technology Corporation (SSSTC)
SSSTC, a subsidiary of KIOXIA Corporation, stands as a global leader in designing, developing, and manufacturing digital storage solutions. Building on its extensive success in Optical Disk Drives, the company established its Solid-State Drive (SSD) Division in 2008 to meet the growing demands for data storage.
SSSTC leads the industry, offering innovative designs, high-quality, and efficient products across a range of interface specifications and external dimensions. Their comprehensive lineup of SSDs caters to Enterprise, Industrial, Business Client, and Consumer markets. These SSDs come in various form factors and interfaces, ensuring the right fit for each application.
The company’s SSDs are entirely developed in-house by dedicated R&D teams, allowing for highly customizable solutions, including firmware design. Through partnerships with industry-leading component suppliers, SSSTC delivers SSD solutions known for their quality, reliability, and commitment to innovation and manufacturing excellence.
For more information, please contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett
DACH: Alex Kessler
Synaptics
Synaptics is a world leading provider of high-end audio solutions for digital headsets and voice-controlled devices.
Digital headset SoCs
Synaptics’ multi-tier headset product line features a wide range of audio codec solutions to meet the needs of various applications including USB Type-C headsets, advanced wireless and 3D gaming headsets, as well as more compact Universal Communication (UC) office headsets. Our broad array of low-power, high-resolution multi-core hardware codecs and audio software technologies enable greater innovation and differentiation within the market, helping manufacturers develop new and exciting high-performance headsets, headphones, hearables and audio accessories.
AudioSmart Far-field voice DSPs
The future is now. Voice has become the most exciting interface for interacting with consumer electronics, from tiny wearables to large appliances. Driven by advancements for the smart home and more broadly consumer IoT, smart speakers, smart thermostats, and smart lighting are quickly advancing due to Audi-oSmart far-field voice technology. Throughout the voice revolution, Synaptics has been bolstering its industry-leading portfolio of advanced audio hardware and software solutions designed to help today’s always-listening voice-enabled devices hear and be heard better.
Link to Synaptics
For more information, please contact:
Jens J. Tybo Jensen
TDK InvenSense
TDK InvenSense is a world leading provider of MEMS motion sensors and MEMS microphones.
MEMS microphones
InvenSense’s analog and digital microphone portfolios build on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. Technological advances like these have enabled machine speech recognition & adaptive noise suppression to become commonplace in consumer devices and other applications.
Humans intuitively understand audio capture to be a critical factor in awareness of their sur-roundings. InvenSense is working to enable the same level of awareness for smart devices with leading-edge MEMS microphones. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications.
MEMS motion sensors
InvenSense was the first company to deliver Motion Interface solutions with fully integrated sensors and robust MotionFusion™ firmware algorithms. Our MotionTracking™ devices enable our customers to integrate Motion Interface capability directly into devices, easily and with minimal development cost and effort. InvenSense is a pioneer and leader in our industry, con-sistently delivering game changing solutions.
We began with the world’s first dual-axis MEMS gyroscopes in 2006 for the digital still camera market, the world’s first integrated 3-axis motion processing solution for smart phones in 2009, the world’s first single-chip integrated 6-axis MotionTracking™ device in 2010, the world’s first integrated 9-axis MotionTracking™ device in 2012; and in 2014, the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single-chip platform solution with onboard Digital Motion Processor (DMP™).
Motion- and gesture-based devices from InvenSense are rapidly becoming a key function in many consumer electronic devices including mobile, wearable, Smart Home, and automotive and industryal devices. Our motion solutions, including gyroscopes, accelerometers, compasses and pressure sensors, detect and track an object’s motion in three-dimensional space, allow-ing consumers to interact with their electronic devices by tracking motion in free space and delivering these motions as input commands.
Link to TDK-InvenSense
For more information, please contact:
Jens J. Tybo Jensen
Aconeer
Acconeer has developed a groundbreaking 3D sensor technology that creates endless possibilities in a wide range of applications within several industries.
The need for an energy-efficient, advanced high-precision 3D sensor in a small form factor is growing rapidly in global technologies such as computer vision, human interaction, AR / VR and the Internet of Things.
Link to Acconeer
For more information, please contact:
Gert Jørgensen
Melexis
Melexis create innovative micro-electronic solutions for the best imaginable future focusing on Automative, Alternative mobility, Smart appliances, Smart Buildings, Robotics, Energy management and Digital Health. Melexis has 18 chips suited for cars, both for powertrain and Chassis-Body-safety.
Melexis' strategy is to focus on innovation, Leadership in sensing and driving solutions and Growth in non-automative markets.
Link to Melexis
For more information, please contact:
Andreas Sternberg
xMEMS
xMEMS Labs is the inventor of the world’s first fully monolithic piezo-MEMS speaker which delivers a new level of performance, size, energy efficiency and uniformity not possible with traditional voice coil or hybrid MEMS approaches.
For more information, please contact:
Soundskrit
Soundskrit's product lineup features both analog and digital directional MEMS microphones which can replace conventional multi-microphone beamforming arrays with a single chip, enabling product designers to improve performance, decrease power consumption, and facilitate easier integration into smaller product form factors.
When used in combination with traditional omni-directional microphones, the Soundskrit two-port directional microphones can reduce the computational effort requirements for dynamic beamforming/audio zoom while maintaining high SNR to effectively distinguish speech from background noise. This capability ensures that the speaker's voice remains clear, even in crowded and noisy settings.
Further enhanced by Soundskrit’s SimplyDSP and SimplyAI software, features such as adjustable beamforming, voice activity detection, off-axis muting, automatic gain control, dynamic noise suppression, de-reverberation, and Direction-of-arrival (DOA) estimation further distinguishes the solutions.
These innovations makes the Soundskrit MEMS microphones ideal for a varaiety of applications including Headsets, TWS Earbuds, Webcams, Security Cameras, Smartspeakers, AR/VR Headsets, Laptops, Tablets, TVs and Conferencing Systems.
For more information, please contact:
Minami Acoustics
Minami Acoustics boasts over 20 years of expertise in the audio industry. As a leading Original Design Manufacturer (ODM), Minami specializes in developing and producing high-quality audio solutions for speakers, headphones, and emerging technologies like AR glasses.
Minami is a trusted ODM partner of top global audio brands, including SENNHEISER, PHILIPS, MOTOROLA, GN, BOSE, and MARSHALL. The company's custom product offerings range from TWS (True Wireless Stereo), gaming headsets, and wireless speakers to cutting-edge technologies like spatial audio headsets, OWS (Open Wearable Sound) with advanced ANC (Active Noise Cancellation), and professional products that are ready for MS Teams Certification.
Minami's Manufacturing Execution System (MES) ensures real-time quality management and traceability, optimizing production processes from raw materials to final shipment and with strategically located facilities in Ganzhou (Jiangxi), Zhongshan (Guangdong), and Penang (Malaysia), Minami can efficiently meet global customer demands.
Founded in 1995, Minami’s vision is to create value through exceptional quality and service as a world leader in electroacoustic product design and manufacturing. The company continues to expand its capabilities with state-of-the-art research and development, including its Technology Center in Zhongshan and a growing Shenzhen campus, while advancing sustainability initiatives as a responsible corporation focused on governance, social, and environmental issues.
For more information, please contact:
EnSilica
EnSilica stands at the forefront of fabless chip manufacturing, specializing in tailor-made ASICs for OEMs and system houses. Additionally, the company offers IC design services, catering to enterprises equipped with their own design teams. Renowned for its world-class proficiency, EnSilica excels in delivering custom RF, mmWave, mixed-signal, and digital ASICs to a diverse clientele spanning the automotive, industrial, healthcare, and communications sectors on a global scale.
EnSilica's comprehensive suite of core IP encompasses cryptography, radar, and communication systems. The company boasts a proven track record of providing high-quality solutions that align with extraordinary industry standards.
Listed below are some core services provided by EnSilica:
- Feasibility and choice of technology
- Specification phase
- ASIC design system and details
- ASIC layout
- Tape out and foundry interface
- Prototype delivery
- Validation of silicon
- Qualification and ramp to production
- Volume delivery and inventory management
- Field return analysis
For more than 20 years, EnSilica has gained solid experience servicing a wide group of companies ranging from start-ups to well established system houses. Over the years, a high number of projects has proven succesful within key areas of custom solutions. EnSilica’s project catalogue spans from module design with embedded software to the development of hadware platforms, including high complex multi-million gate system-on-chip architectures. EnSilica equals high quality and exquisite eye for bringing state of the art ideas to life.
Headquartered near Oxford, UK, EnSilica extends its design centres across the UK, India, and Brazil.
For more information, please contact:
Global Unichip Corporation (GUC)
In the dynamic landscape of advanced ASIC services, GUC sits on top as a market leader, publicly traded on the Taiwan Stock Exchange (TWSE). What sets GUC apart is not just its impressive market presence but also its strategic alliance with Taiwan Semiconductor Manufacturing Co. (TSMC), who has a 35% stake in the company.
This collaboration helps GUC to overcome challenges with technology access for ASIC development and manufacturing. The close ties with TSMC give GUC access to world-class semiconductor processes, from 2nm CMOS and up. With cutting-edge packaging technologies, and a guaranteed production capacity, GUC are setting the stage for innovation.
GUC's comprehensive design services span every phase of the process, including "Spec-in" and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies (APT) such as CoWoS, turnkey manufacturing, and the incorporation of leading-edge technologies like HBM (High-Bandwidth Memory) and Die-to-Die Interconnect IPs. GUC’s APT system ensures integrated, discrete chips in one package, with ultra-computation power and optimized efficiency.
With a technology range extending from 2nm and up, a comprehensive track record of over 250 tape-outs, GUC is very well-positioned in the market. TSMC supplements this position by offering automotive qualified processes, broadening the applicability of GUC's offerings to demanding tasks like autonomous driving. Additionally, GUC supports larger structure widths for ASIC implementation, providing diverse requirements in industrial, telecommunications, networks, and consumer applications.
GUC is for people seeking:
- Cutting-edge ASIC technology for IP
- Addressing processor-intensive tasks in hardware
- Implementing custom System-in-Package solutions
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