Semtech is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms. Semtech focus areas are:
Cellular IoT Solutions Leading edge-to-Cloud solutions delivering the device, software and connectivity services needed to simplify and accelerate data-driven transformation with cellular IoT.
LoRa Wireless RF LoRa®, a long range, low power platform, and the de facto wireless platform of Internet of Things, is highly integrated and cost-effective, boasting a notable battery life of up to 20 years, a 3-mile range in urban environments and a 30-mile range outdoors.
Circuit Protection Sophisticated devices that protect sensitive circuitry from Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Cable Discharge Events (CDE), and other electrical overstress.
Signal Integrity A comprehensive portfolio of innovative optical, analog and mixed-signal semiconductor solutions that serve the rising global demand for high-speed data transmission products.
Professional AV Advanced off-the-shelf technology that enables end-to-end systems and integrates advanced inline signal processing capabilities such as light compression, broadcast quality scaling and audio down-mixing.
PerSe® Smart Sensing
Ultra-low power, feature-rich touch controllers that are optimized for numerous applications and provide best-in-class sensitivity with robust noise immunity to enhance touch and near range proximity detection.
Broadcast Video Award-winning solutions designed specifically to push real-world broadcast boundaries in performance, reach, power, and signal integrity while reducing time to market and design risks. Also provides solutions to switch and resize single multiple audio/video inputs from/to single/multiple outputs over ethernet without the need for a dedicated control box.
A pioneer in power management ICs across networking and industrial power, handheld power and automotive applications, Semtech leads the quest to enable a new class of greener, smarter and smaller end products.
Barcelona-based Ignion SL designs, manufactures and commercializes miniature, off-the-shelf antennas for IoT, mobile connectivity and short-range wireless devices. Founded as an independent antenna product business in 2015, Ignion was born out of the main Fractus operation and combines a respected R&D team with proven manufacturing capabilities and scale to bring to market a new generation of antenna products to meet the mobile and wireless connectivity needs of OEMs.
Telink is a leading provider of ultra-low-power, high-performance wireless connectivity Integrated Circuit (IC) solutions. Established in 2010, the company's advanced technology, stategic partnerships, and dedicated R&D team have made it a premier supplier of custom system-on-chip (SoC) solutions for the Internet of Things (IoT) market.
Its diversified product portfolio includes 2.4GHz proprietary, multi-protocol, and wireless audio SoCs. It also provides a complete set of protocol stacks as well as a mature and complete supply chain that enable rapid development and short time-to-profit.
With Telink we are committed to helping customers develop innovative and powerful products with rich feature sets and our mission is to provide the most reliable, cost-effective, and cutting-edge wireless connectivity solutions for the connected world.
Winbond is a 1B$+ Specialty Memory IC manufacturer from Taiwan with a 30 years history. The portfolio includes both FLASH and DRAM and can offer the entire need for memory solutions in many applications.
The products fit very well to the Nordic industry for 3 key reason: > Winbond offers Long Lifetime Support > The Memory sizes are well suited for the industryal, IoT, Communication and Consumer applications in our territory. > Winbond have their own 12” fabs, and hence have full control of the complete production flow.
The full control of manufacturing secures highest level of quality and includes support for KGD deliveries including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test etc.
Nuvoton is a sister company to the memory supplier Winbond who we have worked with for many years. Both Winbond and Nuvoton belong to the Taiwan based Walsin Group.
Nuvoton is a very well establish supplier of these technologies with full end-to-end support on all products. They are the fastest growing MCU supplier WW and ranked no 7 globally which may be a surprise to EU based customers, as this position is obtained primarily from activities in Asia and America.
The initial focus from the complete portfolio includes:
Synaptics is a world leading provider of high-end audio solutions for digital headsets and voice-controlled devices.
Digital headset SoCs Synaptics’ multi-tier headset product line features a wide range of audio codec solutions to meet the needs of various applications including USB Type-C headsets, advanced wireless and 3D gaming headsets, as well as more compact Universal Communication (UC) office headsets. Our broad array of low-power, high-resolution multi-core hardware codecs and audio software technologies enable greater innovation and differentiation within the market, helping manufacturers develop new and exciting high-performance headsets, headphones, hearables and audio accessories.
AudioSmart Far-field voice DSPs The future is now. Voice has become the most exciting interface for interacting with consumer electronics, from tiny wearables to large appliances. Driven by advancements for the smart home and more broadly consumer IoT, smart speakers, smart thermostats, and smart lighting are quickly advancing due to Audi-oSmart far-field voice technology. Throughout the voice revolution, Synaptics has been bolstering its industry-leading portfolio of advanced audio hardware and software solutions designed to help today’s always-listening voice-enabled devices hear and be heard better.
TDK InvenSense is a world leading provider of MEMS motion sensors and MEMS microphones.
MEMS microphones InvenSense’s analog and digital microphone portfolios build on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. Technological advances like these have enabled machine speech recognition & adaptive noise suppression to become commonplace in consumer devices and other applications.
Humans intuitively understand audio capture to be a critical factor in awareness of their sur-roundings. InvenSense is working to enable the same level of awareness for smart devices with leading-edge MEMS microphones. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications.
MEMS motion sensors InvenSense was the first company to deliver Motion Interface solutions with fully integrated sensors and robust MotionFusion™ firmware algorithms. Our MotionTracking™ devices enable our customers to integrate Motion Interface capability directly into devices, easily and with minimal development cost and effort. InvenSense is a pioneer and leader in our industry, con-sistently delivering game changing solutions.
We began with the world’s first dual-axis MEMS gyroscopes in 2006 for the digital still camera market, the world’s first integrated 3-axis motion processing solution for smart phones in 2009, the world’s first single-chip integrated 6-axis MotionTracking™ device in 2010, the world’s first integrated 9-axis MotionTracking™ device in 2012; and in 2014, the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single-chip platform solution with onboard Digital Motion Processor (DMP™).
Motion- and gesture-based devices from InvenSense are rapidly becoming a key function in many consumer electronic devices including mobile, wearable, Smart Home, and automotive and industryal devices. Our motion solutions, including gyroscopes, accelerometers, compasses and pressure sensors, detect and track an object’s motion in three-dimensional space, allow-ing consumers to interact with their electronic devices by tracking motion in free space and delivering these motions as input commands.
Acconeer has developed a groundbreaking 3D sensor technology that creates endless possibilities in a wide range of applications within several industries.
The need for an energy-efficient, advanced high-precision 3D sensor in a small form factor is growing rapidly in global technologies such as computer vision, human interaction, AR / VR and the Internet of Things.
Melexis create innovative micro-electronic solutions for the best imaginable future focusing on Automative, Alternative mobility, Smart appliances, Smart Buildings, Robotics, Energy management and Digital Health. Melexis has 18 chips suited for cars, both for powertrain and Chassis-Body-safety.
Melexis' strategy is to focus on innovation, Leadership in sensing and driving solutions and Growth in non-automative markets.
xMEMS Labs is the inventor of the world’s first fully monolithic piezo-MEMS speaker which delivers a new level of performance, size, energy efficiency and uniformity not possible with traditional voice coil or hybrid MEMS approaches.
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