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Semtech is a leading supplier of high performance analog and mixed-signal semiconductors and advanced algorithms. Semtech focus areas are:

Wireless RF
Semtech is the inventer of LoRa/FLRC. Long-range, low-power RF for IoT applications, highly integrated and cost-effective, boasting a notable battery life of up to 20 years. All Devices have also FSK option and there are several options from 137MHz up to and above 2,4MHz.

Circuit Protection
Sophisticated devices that protect sensitive circuitry from Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Cable Discharge Events (CDE), and other electrical overstress.

Wireless Charging
Offering turnkey solutions for ranging power levels, support for industry standards and firmware-based flexibility for today’s cutting-edge wearables, mobile devices and indus-trial equipment.

Smart Sensing
Ultra-low power, feature-rich touch controllers that are optimized for numerous applications and provide best-in-class sensitivity with robust noise immunity to enhance touch and near range proximity detection. Can also detect human tissue which can be used to switch on/off equipment when not used sush as smart watches and to control wireless output power when needed.

Power Management
A pioneer in power management ICs across networking and industryal power, handheld power and automotive applications, Semtech leads the quest to enable a new class of greener, smarter and smaller end products.

Broadcast Video
Award-winning solutions designed specifically to push real-world broadcast boundaries in performance, reach, power, and signal integrity while reducing time to market and design risks. Also provides solutions to switch and resize single multiple audio/video inputs from/to single/multiple outputs over ethernet without the need for a dedicated control box.

Link to Semtech

For more information specially on for LoRa

Become member of LoRa Community

For more information contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett

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Barcelona-based Ignion SL designs, manufactures and commercializes miniature, off-the-shelf antennas for IoT, mobile connectivity and short-range wireless devices. Founded as an independent antenna product business in 2015, Ignion was born out of the main Fractus operation and combines a respected R&D team with proven manufacturing capabilities and scale to bring to market a new generation of antenna products to meet the mobile and wireless connectivity needs of OEMs.

Link to Ignion

Link for 24h Fast Track Antenna design service: Click here

For more information contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett 

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Telink is a leading provider of ultra-low-power, high-performance wireless connectivity Integrated Circuit (IC) solutions. Established in 2010, the company's advanced technology, stategic partnerships, and dedicated R&D team have made it a premier supplier of custom system-on-chip (SoC) solutions for the Internet of Things (IoT) market.

Its diversified product portfolio includes 2.4GHz proprietary, multi-protocol, and wireless audio SoCs. It also provides a complete set of protocol stacks as well as a mature and complete supply chain that enable rapid development and short time-to-profit.

With Telink we are committed to helping customers develop innovative and powerful products with rich feature sets and our mission is to provide the most reliable, cost-effective, and cutting-edge wireless connectivity solutions for the connected world.

Link to Telink

For more information contact:

Jens J. Tybo Jensen

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Winbond is a 1B$+ Specialty Memory IC manufacturer from Taiwan with a 30 years history. The portfolio includes both FLASH and DRAM and can offer the entire need for memory solutions in many applications.

The products fit very well to the Nordic industry for 3 key reason:
> Winbond offers Long Lifetime Support
> The Memory sizes are well suited for the industryal, IoT, Communication and Consumer applications in our territory.
> Winbond have their own 12” fabs, and hence have full control of the complete production flow.

The full control of manufacturing secures highest level of quality and includes support for KGD deliveries including SiP package bonding & power/thermal, DRAM simulation, wafer level on speed test etc.

Link to Winbond
 

For more information contact:
DK: Søren Manicus & Rune Domsten
SE, NO: Patrik Särenfors
FI & Baltics: Santtu Korpinen
GB & IR: Duncan Bennett

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TDK InvenSense is a world leading provider of MEMS motion sensors and MEMS microphones.

MEMS microphones
InvenSense’s analog and digital microphone portfolios build on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. Technological advances like these have enabled machine speech recognition & adaptive noise suppression to become commonplace in consumer devices and other applications.

Humans intuitively understand audio capture to be a critical factor in awareness of their sur-roundings. InvenSense is working to enable the same level of awareness for smart devices with leading-edge MEMS microphones. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications.

MEMS motion sensors
InvenSense was the first company to deliver Motion Interface solutions with fully integrated sensors and robust MotionFusion™ firmware algorithms. Our MotionTracking™ devices enable our customers to integrate Motion Interface capability directly into devices, easily and with minimal development cost and effort. InvenSense is a pioneer and leader in our industry, con-sistently delivering game changing solutions.

We began with the world’s first dual-axis MEMS gyroscopes in 2006 for the digital still camera market, the world’s first integrated 3-axis motion processing solution for smart phones in 2009, the world’s first single-chip integrated 6-axis MotionTracking™ device in 2010, the world’s first integrated 9-axis MotionTracking™ device in 2012; and in 2014, the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single-chip platform solution with onboard Digital Motion Processor (DMP™).

Motion- and gesture-based devices from InvenSense are rapidly becoming a key function in many consumer electronic devices including mobile, wearable, Smart Home, and automotive and industryal devices. Our motion solutions, including gyroscopes, accelerometers, compasses and pressure sensors, detect and track an object’s motion in three-dimensional space, allow-ing consumers to interact with their electronic devices by tracking motion in free space and delivering these motions as input commands.

Link to TDK-InvenSense

For more information contact:
Jens J. Tybo Jensen

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Acconeer has developed a groundbreaking 3D sensor technology that creates endless possibilities in a wide range of applications within several industries.

The need for an energy-efficient, advanced high-precision 3D sensor in a small form factor is growing rapidly in global technologies such as computer vision, human interaction, AR / VR and the Internet of Things.

Link to Acconeer

For more information contact:
Jens J. Tybo Jensen

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Melexis create innovative micro-electronic solutions for the best imaginable future focusing on Automative, Alternative mobility, Smart appliances, Smart Buildings, Robotics, Energy management and Digital Health. Melexis has 18 chips suited for cars, both for powertrain and Chassis-Body-safety.

Melexis' strategy is to focus on innovation, Leadership in sensing and driving solutions and Growth in non-automative markets.

Link to Melexis

For more information contact:
Andreas Sternberg

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xMEMS

xMEMS Labs is the inventor of the world’s first fully monolithic piezo-MEMS speaker which delivers a new level of performance, size, energy efficiency and uniformity not possible with traditional voice coil or hybrid MEMS approaches.

Link to xMEMS 

For more information contact:

Jens J. Tybo Jensen 

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